Through Silicon Via (TSV) defect investigations using lateral emission microscopy. - C. Cassidy; J. Teva; Jochen Kraft; Franz Schrank (Microelectron. Reliab., 2010)

Optimized integrated micro-hotplates in CMOS technology. - Martin Siegele; Christoph Gamauf; Alexander Nemecek; Giorgio C. Mutinati; Stephan Steinhauer; Anton Köck; Jochen Kraft; Jorg Siezert; Franz Schrank (NEWCAS, 2013)

Bimetallic nanoparticles for optimizing CMOS integrated SnO2 gas sensor devices. - Giorgio C. Mutinati; Elise Brunet; Olena Yurchenko; Elmar Laubender; Gerald A. Urban; Anton Köck; Stephan Steinhauer; Joerg Siegert; Karl Rohracher; Franz Schrank; Martin Schrems (ESSDERC, 2014)

Manufacturing of 3D integrated sensors and circuits. - Martin Schrems; Joerg Siegert; Peter Dorfi; Jochen Kraft; Ewald Stueckler; Franz Schrank; Siegfried Selberherr (ESSDERC, 2014)

Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. - Eva Grünwald; Jördis Rosc; René Hammer; Peter Czurratis; Matthias Koch; Jochen Kraft; Franz Schrank; Roland Brunner (Microelectron. Reliab., 2016)

Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Lena Goullon; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2017)

Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation. - Lisa Mitterhuber; Stefan Defregger; René Hammer; Julien Magnien; Franz Schrank; Stefan Hörth; Matthias Hutter; Elke Kraker (Microelectron. Reliab., 2017)

Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations. - Eva Kozic; René Hammer; Jördis Rosc; Bernhard Sartory; Joerg Siegert; Franz Schrank; Roland Brunner (Microelectron. Reliab., 2018)

Parameter driven monitoring for a flip-chip LED module under power cycling condition. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2018)

Thermal transient measurement and modelling of a power cycled flip-chip LED module. - Lisa Mitterhuber; Stefan Defregger; Julien Magnien; Jördis Rosc; René Hammer; Lena Goullon; Matthias Hutter; Franz Schrank; Stefan Hörth; Elke Kraker (Microelectron. Reliab., 2018)