Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. - Frøydis Oldervoll; Frode Strisland (Microelectron. Reliab., 2004)

High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization. - Rolf Johannessen; Frøydis Oldervoll; Frode Strisland (Microelectron. Reliab., 2008)