Bondability window and power input for wire bonding. - Lei Han; Fuliang Wang; Wenhu Xu; Jue Zhong (Microelectron. Reliab., 2006)

Realization of Neural Network Inverse System with PLC in Variable Frequency Speed-Regulating System. - Guohai Liu; Fuliang Wang; Yue Shen; Huawei Zhou 001; Hongping Jia; Mei Kang (ISNN (1), 2007)

Experimental Research on Decoupling Control of Multi-motor Variable Frequency System Based on Neural Network Generalized Inverse. - Guohai Liu; Pingyuan Liu; Yue Shen; Fuliang Wang; Mei Kang (ICNSC, 2008)

Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging. - Junhui Li; Luhua Deng; Bangke Ma; Ling gang Liu; Fuliang Wang; Lei Han (Microelectron. Reliab., 2011)

Modeling study of thermosonic flip chip bonding process. - Fuliang Wang; Yun Chen 002 (Microelectron. Reliab., 2012)

Experiment study of dynamic looping process for thermosonic wire bonding. - Fuliang Wang; Yun Chen 002; Lei Han (Microelectron. Reliab., 2012)

CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity. - Wenhao Yao; Hu He; Fuliang Wang (Sensors, 2024)