PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. - Katsuya Kikuchi; Chihiro Ueda; Fumiaki Fujii; Yutaka Akiyama; Naoya Watanabe; Yasuhiro Kitamura; Toshio Gomyo; Toshikazu Okubo; Tetsuya Koyama; Tadashi Kamada; Masahiro Aoyagi; Kanji Otsuka (3DIC, 2011)