Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill. - Akihiro Horibe; Fumiaki Yamada (3DIC, 2009)

Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack. - Keiji Matsumoto; Soichiro Ibaraki; Katsuyuki Sakuma; Fumiaki Yamada (3DIC, 2009)

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. - Yuki Ohara; Akihiro Noriki; Katsuyuki Sakuma; Kang Wook Lee 002; Mariappan Murugesan; Jichoel Bea; Fumiaki Yamada; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2009)

High density 3D integration by pre-applied Inter Chip Fill. - Akihiro Horibe; Kuniaki Sueoka; Katsuyuki Sakuma; Sayuri Kohara; Keiji Matsumoto; Hidekazu Kikuchi; Yasumitsu Orii; Toshiro Mitsuhashi; Fumiaki Yamada (3DIC, 2010)

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. - Toru Ikeda; Masatoshi Oka; Shinya Kawahara; Noriyuki Miyazaki; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada (3DIC, 2011)

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. - Sayuri Kohara; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Fumiaki Yamada; Yasumitsu Orii; Katsuyuki Sakuma; Takahiro Kinoshita; Takashi Kawakami (3DIC, 2011)

Thermo-mechanical evaluation of 3D packages. - Sayuri Kohara; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Fumiaki Yamada; Hiroyuki Mori; Yasumitsu Orii (3DIC, 2013)

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. - Keiji Matsumoto; Soichiro Ibaraki; Kuniaki Sueoka; Katsuyuki Sakuma; Hidekazu Kikuchi; Hiroyuki Mori; Yasumitsu Orii; Fumiaki Yamada; Kohei Fujihara; Junichi Takamatsu; Koji Kondo (3DIC, 2013)

Robust control of active suspension to improve ride comfort with structural constraints. - Fumiaki Yamada; Kohei Suzuki; Tatsuo Toda; Gan Chen; Isao Takami (AMC, 2016)