High-speed solder bump inspection system using a laser scanner and CCD camera. - Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishino; Moritoshi Ando (Syst. Comput. Jpn., 2000)

Development of design and operation supporting techniques for product inspection devices using virtual devices. - Fumiyuki Takahashi; Hideki Abe; Tetsuo Koeduka; Susumu Haga (MVA, 2015)