Superconductor/Semiconductor Hybrid Analog-to-Digital Converter. - Futoshi Furuta; Kazuo Saitoh; Akira Yoshida; Hideo Suzuki (IEICE Trans. Electron., 2008)

6 Tbps/W, 1 Tbps/mm2, 3D interconnect using adaptive timing control and low capacitance TSV. - Futoshi Furuta; Kenichi Osada (3DIC, 2011)

Chip-level TSV integration for rapid prototyping of 3D system LSIs. - Kazuyuki Hozawa; Futoshi Furuta; Yuko Hanaoka; Mayu Aoki; Kenichi Takeda; Katsuyuki Sakuma; Kang Wook Lee 002; Takafumi Fukushima; Mitsumasa Koyanagi (3DIC, 2011)

Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme. - Yasuhiro Shinozuka; Hiroshi Fuketa; Koichi Ishida; Futoshi Furuta; Kenichi Osada; Kenichi Takeda; Makoto Takamiya; Takayasu Sakurai (ISQED, 2013)