Test structure assembly for bump bond yield measurement on high density flip chip technologies. - Miguel Ullán; Manuel Lozano 003; Mokhtar Chmeissani; G. Blanchot; Enric Cabruja; J. García; M. Maiorino; Ricardo Martínez; Giulio Pellegrini; Carles Puigdengoles (Microelectron. Reliab., 2006)

An 8W-2MHz buck converter with adaptive dead time tolerant to radiation and high magnetic field. - Stefano Michelis; Bruno Allongue; G. Blanchot; Simone Buso; Federico Faccio; Cristian Fuentes; Alessandro Marchioro; Stefano Orlandi; Stefano Saggini; Giorgio Spiazzi; Maher Kayal (ESSCIRC, 2010)