Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. - V. Born; M. Beck; O. Bosholm; D. Dalleau; S. Glenz; I. Haverkamp; G. Kurz; F. Lange; Anja Vest (Microelectron. Reliab., 2009)

HTOL SRAM Vmin shift considerations in scaled HKMG technologies. - S. Balasubramanian; Vivek Joshi; Torsten Klick; Randy W. Mann; Joseph Versaggi; Akhilesh Gautam; C. Weintraub; G. Kurz; G. Krause; Andreas Kerber; Biju Parameshwaran; Tanya Nigam (CICC, 2014)