Prediction and verification of process induced warpage of electronic packages. - W. D. van Driel; G. Q. Zhang; J. H. J. Janssen; Leo J. Ernst; Fei Su; Kerm Sin Chian; Sung Yi (Microelectron. Reliab., 2003)

The challenges of virtual prototyping and qualification for future microelectronics. - G. Q. Zhang (Microelectron. Reliab., 2003)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. - Willem D. van Driel; C. J. Liu; G. Q. Zhang; J. H. J. Janssen; Richard B. R. van Silfhout; Marcel A. J. van Gils; Leo J. Ernst (Microelectron. Reliab., 2004)

Characterization and fatigue damage simulation in SAC solder joints. - Müge Erinc; Piet J. G. Schreurs; G. Q. Zhang; Marc G. D. Geers (Microelectron. Reliab., 2004)

Multi-physics modeling in virtual prototyping of electronic packages–combined thermal, thermo-mechanical and vapor pressure modeling. - Xuejun Fan; Jiang Zhou; G. Q. Zhang (Microelectron. Reliab., 2004)

Characterization and Modelling of Moisture Driven Interface Failures. - Marcel A. J. van Gils; P. J. J. H. A. Habets; G. Q. Zhang; Willem D. van Driel; Piet J. G. Schreurs (Microelectron. Reliab., 2004)

Prediction of thermo-mechanical integrity of wafer backend processes. - Viktor Gonda; Jaap M. J. den Toonder; Johan Beijer; G. Q. Zhang; Willem D. van Driel; Romano J. O. M. Hoofman; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of crack growth in IC passivation layers. - Y. T. He; Marcel A. J. van Gils; Willem D. van Driel; G. Q. Zhang; Richard B. R. van Silfhout; Leo J. Ernst (Microelectron. Reliab., 2004)

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. - Dao-Guo Yang; J. S. Liang; Quan-Yong Li; Leo J. Ernst; G. Q. Zhang (Microelectron. Reliab., 2004)

Integrated thermo-mechanical design and qualification of wafer backend structures. - G. Q. Zhang; Jaap Bisschop (Microelectron. Reliab., 2004)

Prediction of Delamination Related IC & Packaging Reliability Problems. - W. D. van Driel; Marcel A. J. van Gils; Richard B. R. van Silfhout; G. Q. Zhang (Microelectron. Reliab., 2005)

Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. - G. Q. Zhang; K. K. Lai (Eur. J. Oper. Res., 2006)

Reliability modelling for packages in flexible end-products. - W. D. van Driel; Olaf van der Sluis; Dao-Guo Yang; R. L. J. M. Ubachs; C. Zenz; G. Aflenzer; G. Q. Zhang (Microelectron. Reliab., 2006)

Reliability challenges in the nanoelectronics era. - A. J. van Roosmalen; G. Q. Zhang (Microelectron. Reliab., 2006)

Multiscale modelling of multilayer substrates. - R. L. J. M. Ubachs; Olaf van der Sluis; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2006)

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. - Cadmus A. Yuan; Willem D. van Driel; Richard B. R. van Silfhout; Olaf van der Sluis; Roy A. B. Engelen; Leo J. Ernst; Fred van Keulen; G. Q. Zhang (Microelectron. Reliab., 2006)

Correlation between chemistry of polymer building blocks and microelectronics reliability. - H. J. L. Bressers; W. D. van Driel; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang (Microelectron. Reliab., 2007)

Advanced structural similarity rules for the BGA package family. - W. D. van Driel; A. Mavinkurve; Marcel A. J. van Gils; G. Q. Zhang (Microelectron. Reliab., 2007)

Mechanical reliability challenges for MEMS packages: Capping. - Willem D. van Driel; Dao-Guo Yang; Cadmus A. Yuan; M. van Kleef; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2007)

Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Analysis of Cu/low-k bond pad delamination by using a novel failure index. - Marcel A. J. van Gils; Olaf van der Sluis; G. Q. Zhang; J. H. J. Janssen; R. M. J. Voncken (Microelectron. Reliab., 2007)

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. - Viktor Gonda; Kaspar M. B. Jansen; Leo J. Ernst; Jaap M. J. den Toonder; G. Q. Zhang (Microelectron. Reliab., 2007)

Novel shear tools for viscoelastic characterization of packaging polymers. - C. van't Hof; Kaspar M. B. Jansen; G. Wisse; Leo J. Ernst; Dao-Guo Yang; G. Q. Zhang; H. J. L. Bressers (Microelectron. Reliab., 2007)

Characterization of moisture properties of polymers for IC packaging. - Xiaosong Ma; Kaspar M. B. Jansen; Leo J. Ernst; W. D. van Driel; Olaf van der Sluis; G. Q. Zhang (Microelectron. Reliab., 2007)

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. - Artur Wymyslowski; W. D. van Driel; J. van de Peer; N. Tzannetakis; G. Q. Zhang (Microelectron. Reliab., 2007)

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Numerical modeling of warpage induced in QFN array molding process. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; W. D. van Driel; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Molecular simulation on the material/interfacial strength of the low-dielectric materials. - Cadmus A. Yuan; Olaf van der Sluis; G. Q. (Kouchi) Zhang; Leo J. Ernst; Willem D. van Driel; Richard B. R. van Silfhout (Microelectron. Reliab., 2007)

On chip-package stress interaction. - W. D. van Driel; Dao-Guo Yang; G. Q. Zhang (Microelectron. Reliab., 2008)

Failure analysis of a thin-film nitride MEMS package. - Q. Li; J. F. L. Goosen; J. T. M. van Beek; Fred van Keulen; K. L. Phan; G. Q. Zhang (Microelectron. Reliab., 2008)

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. - Fenglian Sun; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

The need for multi-scale approaches in Cu/low-k reliability issues. - Cadmus A. Yuan; Olaf van der Sluis; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

Packaging influences on the reliability of MEMS resonators. - Jeroen J. M. Zaal; W. D. van Driel; S. Bendida; Q. Li; J. T. M. van Beek; G. Q. Zhang (Microelectron. Reliab., 2008)

Comparing drop impact test method using strain gauge measurements. - Y. Liu; F. J. H. G. Kessels; Willem D. van Driel; J. A. S. van Driel; F. L. Sun; G. Q. Zhang (Microelectron. Reliab., 2009)

Numerical prediction of failure paths at a roughened metal/polymer interface. - S. P. M. Noijen; Olaf van der Sluis; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. - Olaf van der Sluis; R. A. B. Engelen; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. - Jeroen J. M. Zaal; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2009)

A fast moisture sensitivity level qualification method. - Xiaosong Ma; Kaspar M. B. Jansen; G. Q. Zhang; Willem D. van Driel; Olaf van der Sluis; Leo J. Ernst; C. Regards; Christian Gautier; Hélène Frémont (Microelectron. Reliab., 2010)

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. - Jeroen J. M. Zaal; Willem D. van Driel; G. Q. Zhang (Sensors, 2010)

A Distributed Semantic Web Approach for Cohort Identification. - Joseph Teagno; Richard C. Kiefer; Jyotishman Pathak; G. Q. Zhang; Satya Sanket Sahoo (AMIA, 2012)

Effects of single vacancy defect position on the stability of carbon nanotubes. - R. H. Poelma; H. Sadeghian; Sau Koh; G. Q. Zhang (Microelectron. Reliab., 2012)

An approach to "Design for Reliability" in solid state lighting systems at high temperatures. - S. Tarashioon; Alessandro Baiano; Henk W. van Zeijl; C. Guo; S. W. Koh; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2012)

Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach. - Jianfei Dong; Ashish Pandharipande; Willem D. van Driel; Guoqi Zhang (IEEE Trans. Signal Process., 2012)

Carbon Nanotube based heat-sink for solid state lighting. - F. Santagata; G. Almanno; Sten Vollebregt; Cinzia Silvestri; G. Q. Zhang; Pasqualina M. Sarro (NEMS, 2013)

A novel soldering method to evaluate PCB pad cratering for pin-pull testing. - Miao Cai; D. J. Xie; W. B. Chen; B. Y. Wu; Dao-Guo Yang; G. Q. Zhang (Microelectron. Reliab., 2013)

Blue selective photodiodes for optical feedback in LED wafer level packages. - Zahra Kolahdouz Esfahani; Teng Ma; Henk W. van Zeijl; G. Q. Zhang; Ali Rostamian; Mohammadreza Kolahdouz (ESSDERC, 2014)

Thermal and mechanical effects of voids within flip chip soldering in LED packages. - Yang Liu 103; Stanley Y. Y. Leung; Jia Zhao; Cell K. Y. Wong; Cadmus A. Yuan; Guoqi Zhang; Fenglian Sun; Liangliang Luo (Microelectron. Reliab., 2014)

Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. - M. Yazdan Mehr; W. D. van Driel; Kaspar M. B. Jansen; P. Deeben; G. Q. Zhang (Microelectron. Reliab., 2014)

Reliability and optical properties of LED lens plates under high temperature stress. - M. Yazdan Mehr; Willem D. van Driel; Sau Koh; Guoqi Zhang (Microelectron. Reliab., 2014)

Accelerated life time testing and optical degradation of remote phosphor plates. - M. Yazdan Mehr; Willem D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2014)

Multi-physics reliability simulation for solid state lighting drivers. - S. Tarashioon; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2014)

Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes. - Huaiyu Ye; Bo Li; Hongyu Tang; Jia Zhao; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2014)

A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes. - Huaiyu Ye; Robert Sokolovskij; Henk W. van Zeijl; Alexander W. J. Gielen; Guoqi Zhang (Microelectron. Reliab., 2014)

Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system. - Huaiyu Ye; Jia Wei; Henk W. van Zeijl; Pasqualina M. Sarro; Guoqi Zhang (Microelectron. Reliab., 2014)

Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. - Miao Cai; Dao-Guo Yang; Kunmiao Tian; Ping Zhang; Xianping Chen; Lilin Liu; Guoqi Zhang (Microelectron. Reliab., 2015)

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. - Jianlin Huang; Dusan S. Golubovic; Sau Koh; Dao-Guo Yang; Xiupeng Li; Xuejun Fan; G. Q. Zhang (Microelectron. Reliab., 2015)

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. - Yang Liu 103; Fenglian Sun; Hao Zhang 034; Tong Xin; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2015)

Applications of advanced controlmethods in spacecrafts: progress, challenges, and future prospects. - Yongchun Xie; Huang Huang; Yong Hu; Guoqi Zhang (Frontiers Inf. Technol. Electron. Eng., 2016)

Effects of stress-loading test methods on the degradation of light-emitting diode modules. - Miao Cai; Dao-Guo Yang; Jianna Zheng; Jianlin Huang; Dongjing Liu; Jing Xiao 003; Ping Zhang; Guoqi Zhang; Xianping Chen (Microelectron. Reliab., 2016)

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. - Jianlin Huang; Dusan S. Golubovic; Sau Koh; Dao-Guo Yang; Xiupeng Li; Xuejun Fan; G. Q. Zhang (Reliab. Eng. Syst. Saf., 2016)

PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers. - Bo Sun 002; Xuejun Fan; Cheng Qian 003; Guoqi Zhang (IEEE Trans. Ind. Electron., 2016)

High aspect ratio spiral resonators for process variation investigation and MEMS applications. - Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; G. Q. Zhang; R. H. Poelma (IEEE SENSORS, 2017)

Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection. - Robert Sokolovskij; Elina Iervolino; Changhui Zhao; Fei Wang 025; Hongyu Yu; Fabio Santagata; Pasqualina M. Sarro; Guoqi Zhang (IEEE SENSORS, 2017)

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method. - Cheng Qian 003; Jiajie Fan; Xuejun Fan; Guoqi Zhang (IEEE Access, 2017)

Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. - Hongyu Tang; Huaiyu Ye; Xianping Chen; Cheng Qian 003; Xuejun Fan; Guoqi Zhang (IEEE Access, 2017)

Modeling nonlinear moisture diffusion in inhomogeneous media. - Liangbiao Chen; Jiang Zhou; Hsing-wei Chu; Guoqi Zhang; Xuejun Fan (Microelectron. Reliab., 2017)

Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages. - Jiajie Fan; Chaohua Yu; Cheng Qian 003; Xuejun Fan; Guoqi Zhang (Microelectron. Reliab., 2017)

Color shift acceleration on mid-power LED packages. - Guangjun Lu; W. D. van Driel; Xuejun Fan; Jiajie Fan; Cheng Qian 003; G. Q. Zhang (Microelectron. Reliab., 2017)

Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. - M. Yazdan Mehr; M. R. Toroghinejad; F. Karimzadeh; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2017)

Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method. - Cheng Qian 003; Yun Li; Jiajie Fan; Xuejun Fan; Jiajia Fu; Lixia Zhao; Guoqi Zhang (Microelectron. Reliab., 2017)

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component. - Hongyu Tang; Huaiyu Ye; Cell K. Y. Wong; Stanely Y. Y. Leung; Jiajie Fan; Xianping Chen; Xuejun Fan; Guoqi Zhang (Microelectron. Reliab., 2017)

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. - Bo Sun 002; Xuejun Fan; Huaiyu Ye; Jiajie Fan; Cheng Qian 003; Willem D. van Driel; Guoqi Zhang (Reliab. Eng. Syst. Saf., 2017)

Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems. - Jianfei Dong; Guoqi Zhang (IEEE Trans. Ind. Electron., 2017)

Thermal Management on IGBT Power Electronic Devices and Modules. - Cheng Qian 003; Amir Mirza Gheitaghy; Jiajie Fan; Hongyu Tang; Bo Sun 002; Huaiyu Ye; Guoqi Zhang (IEEE Access, 2018)

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. - Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian 003; Xuejun Fan; Guoqi Zhang (Microelectron. Reliab., 2018)

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. - Ibrahim Khalilullah; Talukder Reza; Liangbiao Chen; Mark D. Placette; A. K. M. Monayem H. Mazumder; Jiang Zhou; Jiajie Fan; Cheng Qian 003; Guoqi Zhang; Xuejun Fan (Microelectron. Reliab., 2018)

A review on discoloration and high accelerated testing of optical materials in LED based-products. - M. Yazdan Mehr; M. R. Toroghinejad; F. Karimzadeh; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2018)

A new hermetic sealing method for ceramic package using nanosilver sintering technology. - Hao Zhang 034; Yang Liu 103; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; Guoqi Zhang (Microelectron. Reliab., 2018)

A stochastic process based reliability prediction method for LED driver. - Bo Sun 002; Xuejun Fan; Willem D. van Driel; Chengqiang Cui; Guoqi Zhang (Reliab. Eng. Syst. Saf., 2018)

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. - Ning Yang 002; Dao-Guo Yang; Guoqi Zhang; Liangbiao Chen; Dongjing Liu; Miao Cai; Xuejun Fan (Sensors, 2018)

Recessed gate Pt-AlGaN/GaN HEMT H2 sensor. - Robert Sokolovskij; J. Zhang; H. Zheng; W. Li; Yang Jiang; G. Yang; Hongyu Yu; Pasqualina M. Sarro; G. Q. Zhang (IEEE SENSORS, 2019)

Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method. - Miao Cai; Zhi Liang; Kunmiao Tian; Minghui Yun; Ping Zhang; Dao-Guo Yang; Guoqi Zhang (IEEE Access, 2019)

Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. - Miao Cai; Yonghu Liang; Minghui Yun; Xuan-You Chen; Haidong Yan; Zhaozhe Yu; Dao-Guo Yang; Guoqi Zhang (IEEE Access, 2019)

Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method. - Wei Chen; Jiajie Fan; Cheng Qian 003; Bin Pu; Xuejun Fan; Guoqi Zhang (IEEE Access, 2019)

A Reliability Prediction Methodology for LED Arrays. - Bo Sun 002; Jiajie Fan; Xuejun Fan; Guoqi Zhang; Guohao Zhang (IEEE Access, 2019)

Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group. - Y. Ye; Richard D. Boyce; M. K. Davis; Keith O. Elliston; Christos Davatzikos; Andrey Fedorov; Jean-Christophe Fillion-Robin; Ian T. Foster; John R. Gilbertson; Mervi Heiskanen; Juli D. Klemm; Andras Lasso; et al. (CoRR, 2019)

Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors. - Luke M. Middelburg; Mohammadamir Ghaderi; David Bilby; Jacobus H. Visser; G. Q. Zhang; Reinoud F. Wolffenbuttel (ISIE, 2020)

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review. - Miao Cai; Peng Cui; Yikang Qin; Daoshuang Geng; Qiqin Wei; Xiyou Wang; Dao-Guo Yang; Guoqi Zhang (Entropy, 2020)

Solving Virtual Network Mapping Fast by Combining Neural Network and MCTS. - Cong Wang 009; Xiaoyang Chen; Yixin Luo; Guoqi Zhang (CBD, 2021)

Resistive and CTAT Temperature Sensors in a Silicon Carbide CMOS Technology. - Joost Romijn; Luke M. Middelburg; Sten Vollebregt; Brahim El Mansouri; Henk W. van Zeijl; Alexander May 004; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro (IEEE SENSORS, 2021)

Mastering the Game of Amazons Fast by Decoupling Network Learning. - Guoqi Zhang; Xiaoyang Chen; Ruidong Chang; Yuhang Zhang; Cong Wang 009; Luyi Bai; Junwei Wang; Changming Xu (IJCNN, 2021)

Fabrication of Nanoslits with Etching TSWE Method. - Hao Hong; Li Ye; Ke Li; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu 003 (NEMS, 2021)

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects. - Leiming Du; Xiujuan Zhao; Piet Watté; René Poelma; Willem D. van Driel; Guoqi Zhang (IECON, 2022)

ZnO Nanoparticle Printing for UV Sensor Fabrication. - Hendrik Joost Van Ginkel; Mattia Orvietani; Joost Romijn; Guoqi Zhang; Sten Vollebregt (IEEE SENSORS, 2022)

Automatically recognize and segment morphological features of the 3D vertebra based on topological data analysis. - Pengfei Cheng; Xiaohan Cao; Yusheng Yang; Guoqi Zhang; Yongyi He (Comput. Biol. Medicine, 2022)

Analyzing Efficacy and Safety of Anti-Fungal Blue Light Therapy via Kernel-Based Modeling the Reactive Oxygen Species Induced by Light. - Tianfeng Wang; Jianfei Dong; Guoqi Zhang (IEEE Trans. Biomed. Eng., 2022)

Analysis and Data-Based Modeling of the Photochemical Reaction Dynamics of the Induced Singlet Oxygen in Light Therapies. - Tianfeng Wang; Jianfei Dong; Guoqi Zhang (IEEE Trans. Biomed. Eng., 2022)

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. - Alexandru Prisacaru; Przemyslaw Jakub Gromala; Bongtae Han; Guoqi Zhang (IEEE Trans. Ind. Electron., 2022)

Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications. - Yunfan Niu; Jiarui Mo; Alexander May 004; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt (SENSORS, 2023)

RNN-Based Quadratic Programming Scheme for Tennis-Training Robots With Flexible Capabilities. - Long Jin 001; Guoqi Zhang; Yang Wang 069; Shuai Li 002 (IEEE Trans. Syst. Man Cybern. Syst., 2023)

Ball-Spin Control and Vibration Reduction Methods for Three-Wheel Pitching Device of Tennis Training Robot. - Guoqi Zhang; Long Jin 001; Shuai Li 002 (J. Intell. Robotic Syst., 2023)

A 70-V Fully Integrated Dual-SSHC Rectifier for Triboelectric Energy Harvesting with Full-Digital Duty-Cycle-Based MPPT Achieving 598% Power Extraction Enhancement. - Wenyu Peng; Xinling Yue; Willem D. van Driel; Guoqi Zhang; Sijun Du (CICC, 2024)

An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting. - Wenyu Peng; Willem D. van Driel; Guoqi Zhang; Sijun Du (ISCAS, 2024)

AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. - Varun Thukral; Chen He; Rebecca Chen; Letian Zhang; Romuald Roucou; Michiel van Soestbergen; Jeroen J. M. Zaal; Rene Rongen; Willem D. van Driel; G. Q. Zhang (ITC, 2024)

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks. - Minzhen Wen; Mesfin S. Ibrahim; Abdulmelik Husen Meda; Guoqi Zhang; Jiajie Fan (Expert Syst. Appl., 2024)

Data-Driven Remote Center of Cyclic Motion (RC$^{2}$M) Control for Redundant Robots With Rod-Shaped End-Effector. - Mei Liu; Kun Liu; Puchen Zhu; G. Q. (Kouchi) Zhang; Xin Ma; Mingsheng Shang 001 (IEEE Trans. Ind. Informatics, 2024)

Hyperspectral Detection of Pesticide Residues in Black Vegetable Based on Multi-Classifier Entropy Weight Method. - Rongchang Jiang; Guoqiang Zhuang; Shijie Xie; Yang Wang 069; Guoqi Zhang; Dandan Qu; Wanzhi Wen (IEEE Access, 2025)

SDGMPS: A spin-dependent Glauber model program for elastic proton-nucleus scattering. - Jingtao Zhang; Xiaolin Tu; Y. Huang; L. Y. Li; G. Q. Zhang; Zenghua Li (Comput. Phys. Commun., 2025)

A Fully Integrated Electrostatic Charge Boosting Rectifier for Triboelectric Energy Harvesting. - Wenyu Peng; Xinling Yue; Willem D. van Driel; Guoqi Zhang; Sijun Du (IEEE J. Solid State Circuits, 2025)

Adaptive Bayesian Data-Driven Design of Reliable Solder Joints for Micro-electronic Devices. - Leo Guo; Adwait Inamdar; Willem D. van Driel; Guoqi Zhang (CoRR, 2025)