Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

Heat spreading packaging solutions for hybrid bonded 3D-ICs. - Rafael Prieto; Perceval Coudrain; Jean-Philippe Colonna; Y. Hallez; Christian Chancel; Venceslass Rat; Sylvain Dumas; G. Romano; R. Franiatte; C. Brunet-Manquiat; Séverine Cheramy; Alexis Farcy (3DIC, 2016)

Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. - Jessy Micout; Quentin Rafhay; Xavier Garros; Mikaël Cassé; Jean Coignus; Luca Pasini; Cao-Minh Vincent Lu; Nils Rambal; Claire Fenouillet-Béranger; Laurent Brunet; G. Romano; R. Gassilloud; et al. (ESSDERC, 2017)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration. - Tadeu Mota Frutuoso; Xavier Garros; Perrine Batude; Laurent Brunet; Joris Lacord; Benoit Sklénard; V. Lapras; Claire Fenouillet-Béranger; M. Ribotta; A. Magalhaes-Lucas; J. Kanyandekwe; R. Kies; et al. (VLSI Technology and Circuits, 2022)

Breakthrough Processes for Si CMOS Devices with BEOL Compatibility for 3D Sequential Integrated more than Moore Analog Applications. - Daphnée Bosch; Abygaël Viey; Tadeu Mota Frutuoso; P. Lheritier; C. Licitra; Nada Zerhouni; A. Albouy; Laurent Brunet; A. Magalhaes-Lucas; L. M. B. da Silva; H. Boutry; M. Husien Fahmy Taha Abdelrahman; et al. (VLSI Technology and Circuits, 2024)