Miniaturized and high-performance RF packages with ultra-thin glass substrates. - Min Suk Kim; Markondeya Raj Pulugurtha; Youngwoo Kim; Gapyeol Park; Kyungjun Cho; Vanessa Smet; Venky Sundaram; Joungho Kim; Rao R. Tummala (Microelectron. J., 2018)