Dual-tapered-piston (DTP) module cooling for IBM Enterprise System/9000 systems. - Gary F. Goth; Michael L. Zumbrunnen; Kevin P. Moran (IBM J. Res. Dev., 1992)

A power, packaging, and cooling overview of the IBM eServer z900. - Prabjit Singh; Steven J. Ahladas; Wiren Dale Becker; Frank E. Bosco; Joseph P. Corrado; Gary F. Goth; Sushumna Iruvanti; Matthew A. Nobile; Budy D. Notohardjono; John H. Quick; Edward J. Seminaro; Kwok M. Soohoo; et al. (IBM J. Res. Dev., 2002)

Hybrid cooling with cycle steering in the IBM eServer z990. - Gary F. Goth; Daniel J. Kearney; Udo Meyer; Donald W. Porter (IBM J. Res. Dev., 2004)

High-speed interconnect and packaging design of the IBM System z9 processor cage. - Hubert Harrer; Daniel M. Dreps; Thomas-Michael Winkel; Wolfgang Scholz; Bao G. Truong; Andreas Huber; Tingdong Zhou; Kenneth L. Christian; Gary F. Goth (IBM J. Res. Dev., 2007)

Packaging design of the IBM System z10 Enterprise Class platform central electronic complex. - John G. Torok; Frank E. Bosco; W. L. Brodsky; E. F. Furey; Gary F. Goth; Daniel J. Kearney; John J. Loparco; M. T. Peets; K. L. Pizzolato; Donald W. Porter; G. Ruehle; W. H. White (IBM J. Res. Dev., 2009)

IBM zEnterprise energy management. - Michael Andres; Andreas Bieswanger; Frank E. Bosco; Gary F. Goth; Hannes Hering; William P. Kostenko; Thomas B. Mathias; Thomas Pohl; Huajun Wen (IBM J. Res. Dev., 2012)

IBM z13: Energy efficiency, increased environmental range, and flexible data center characteristics. - William P. Kostenko; Dustin W. Demetriou; Gary F. Goth (IBM J. Res. Dev., 2015)

Mechanical packaging, power, and cooling design for the IBM z13. - John G. Torok; Frank E. Bosco; Gary F. Goth; John J. Loparco; M. T. Peets; Donald W. Porter; S. G. Shevach; B. C. Tucker; A. C. VanDeventer; X. Wei; P. A. Wendling; Y. Yu; et al. (IBM J. Res. Dev., 2015)