Global routing and track assignment for flip-chip designs. - Xiaodong Liu 018; Yifan Zhang; Gary K. Yeap; Chunlei Chu; Jian Sun 005; Xuan Zeng 001 (DAC, 2010)

An integrated algorithm for 3D-IC TSV assignment. - Xiaodong Liu 018; Yifan Zhang; Gary K. Yeap; Xuan Zeng 001 (DAC, 2011)

Integrated Algorithm for 3-D IC Through-Silicon Via Assignment. - Xiaodong Liu 018; Gary K. Yeap; Jun Tao 001; Xuan Zeng 001 (IEEE Trans. Very Large Scale Integr. Syst., 2014)