Improved post-silicon power modeling using AC lock-in techniques. - Abdullah Nazma Nowroz; Gary L. Woods; Sherief Reda (DAC, 2011)

Work in progress - Implementing and evaluating efforts to engage interdisciplinary teams to solve real-world design challenges. - Z. Maria Oden; Marcia K. O'Malley; Gary L. Woods; Tracy M. Volz (FIE, 2011)

High-throughput TSV testing and characterization for 3D integration using thermal mapping. - Kapil Dev; Gary L. Woods; Sherief Reda (DAC, 2013)

Power Mapping of Integrated Circuits Using AC-Based Thermography. - Abdullah Nazma Nowroz; Gary L. Woods; Sherief Reda (IEEE Trans. Very Large Scale Integr. Syst., 2013)