Modeling the Plasma Enhanced Chemical Vapor Deposition Process Using Neural Networks and Genetic Algorithms. - Seung Soo Han; Gary S. May (ICTAI, 1994)

Optimization of Neural Network Structure and Learning Parameters Using Genetic Algorithms. - Seung Soo Han; Gary S. May (ICTAI, 1996)

Microelectronics Fabrication Training Using Multimedia and the Web. - Gary S. May (IEEE Multim., 1996)

Neural network based adaptive tracking controller for a reactive ion etching system. - Yubo Pei; Gary S. May (ACC, 2001)

Indirect adaptive control of reactive ion etching using neural networks. - David Stokes; Gary S. May (IEEE Trans. Robotics Autom., 2001)

Neural-Network-Based Sensor Fusion of Optical Emission and Mass Spectroscopy Data for Real-Time Fault Detection in Reactive Ion Etching. - Sang Jeen Hong; Gary S. May (IEEE Trans. Ind. Electron., 2005)

Characterization and Optimization of the Contact Formation for High-Performance Silicon Solar Cells. - SungJoon Lee; A. Pandey; DongSeop Kim; Ajeet Rohatgi; Gary S. May; Sang Jeen Hong; Seung Soo Han (ISNN (3), 2007)

A comparison of genetic and particle swarm optimization for contact formation in high-performance silicon solar cells. - Hyun-Soo Kim; Bryan G. Morris; Seung Soo Han; Gary S. May (IJCNN, 2008)

Optimization of silicon solar cell fabrication based on neural network and genetic programming modeling. - Hyeon Bae; Tae-Ryong Jeon; Sungshin Kim; Hyun-Soo Kim; DongSeop Kim; Seung Soo Han; Gary S. May (Soft Comput., 2010)

Silicon interposer platform with low-loss through-silicon vias using air. - Hanju Oh; Gary S. May; Muhannad S. Bakir (3DIC, 2015)

Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. - Pyungwoo Yeon; Joe L. Gonzalez; Muneeb Zia; Sreejith Kochupurackal Rajan; Gary S. May; Muhannad S. Bakir; Maysam Ghovanloo (BioCAS, 2017)

High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. - Sreejith Kochupurackal Rajan; Ming Jui Li; Muhannad S. Bakir; Gary S. May (3DIC, 2019)

Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. - Sreejith Kochupurackal Rajan; Ankit Kaul; Gary S. May; Muhannad S. Bakir (3DIC, 2021)