Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. - Gayle Murdoch; Matin O'Toole; Giulio Marti; Ankit Pokhrel; Diana Tsvetanova; Stefan Decoster; Shreya Kundu; Yusuke Oniki; Arame Thiam; Quoc Toan Le; Olalla Varela Pedreira; Alicja Lesniewska; et al. (VLSI Technology and Circuits, 2022)