Towards ultra-dense arrays of VHF NEMS with FDSOI-CMOS active pixels for sensing applications. - Gregory Arndt; Cecilia Dupre; Julien Arcamone; Gerald Cibrario; Olivier Rozeau; Laurent Duraffourg; Eric Ollier; Éric Colinet (ISSCC, 2012)

A 3D Process Design Kit generator based on customizable 3D layout design environment. - Gerald Cibrario; David Henry; Chantal Chantre; Robert Cuchet; Robert Berthelot; Karim Azizi-Mourier; Marjorie Gary; Fabien Gays (3DIC, 2013)

3D FPGA using high-density interconnect Monolithic Integration. - Ogun Turkyilmaz; Gerald Cibrario; Olivier Rozeau; Perrine Batude; Fabien Clermidy (DATE, 2014)

A high-level design rule library addressing CMOS and heterogeneous technologies. - Gerald Cibrario; Marjorie Gary; Fabien Gays; Karim Azizi-Mourier; Olivier Billoint; Ogun Turkyilmaz; Olivier Rozeau (ICICDT, 2014)

A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. - Olivier Billoint; Hossam Sarhan; Iyad Rayane; Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Olivier Rozeau; Gerald Cibrario; Fabien Deprat; A. Fustier; Julien Michallet; Olivier Faynot; et al. (DATE, 2015)

From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. - Olivier Billoint; Hossam Sarhan; Iyad Rayane; Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Olivier Rozeau; Gerald Cibrario; Fabien Deprat; Ogun Turkyilmaz; Sébastien Thuries; Fabien Clermidy (ISPD, 2015)

From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose. - Gerald Cibrario; Nour Ben Salem; Joris Lacord; Karim Azizi-Mourier; Olivier Rozeau; Etienne Maurin; Olivier Billoint; Sébastien Thuries; Alexandre Valentian (3DIC, 2016)

Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. - Melanie Brocard; Guillaume Berhault; Sébastien Thuries; Fabien Clermidy; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; François Andrieu; Fabien Deprat; Joris Lacord; Olivier Rozeau; Gerald Cibrario; et al. (ESSDERC, 2016)

Opportunities brought by sequential 3D CoolCube™ integration. - Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ESSDERC, 2016)

Recent advances in 3D VLSI integration. - Claire Fenouillet-Béranger; Perrine Batude; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; M.-P. Samson; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ICICDT, 2016)

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. - Melanie Brocard; Benoît Mathieu; Jean-Philippe Colonna; Cristiano Santos; Claire Fenouillet-Béranger; Cao-Minh Vincent Lu; Gerald Cibrario; Laurent Brunet; Perrine Batude; François Andrieu; Sébastien Thuries; Olivier Billoint (ISVLSI, 2017)

Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. - Olivier Billoint; Karim Azizi-Mourier; Gerald Cibrario; Didier Lattard; Mehdi Mouhdach; Sébastien Thuries; Pascal Vivet (3DIC, 2019)

Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process. - Behnam Samadpoor Rikan; Philipp Häfliger; Gerald Cibrario; Olivier Billoint; Mehdi Mouhdach (MWSCAS, 2021)