Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. - A. Vandooren; Liesbeth Witters; Jacopo Franco; Arindam Mallik; Bertrand Parvais; Z. Wu; Amey Walke; V. Deshpande; E. Rosseel; Andriy Hikavyy; W. Li; L. Peng; et al. (ICICDT, 2018)