Integration of intra chip stack fluidic cooling using thin-layer solder bonding. - Yassir Madhour; Michael Zervas; Gerd Schlottig; Thomas Brunschwiler; Yusuf Leblebici; John Richard Thome; Bruno Michel (3DIC, 2013)

Industrial approach to the chip and package reliability of SiC MOSFETs (Invited). - Elena Mengotti; Enea Bianda; David Baumann; Gerd Schlottig; Francisco Canales (IRPS, 2023)