Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling. - Gerhard K. M. Wachutka (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1990)

Nonisothermal device simulation using the 2D numerical process/device simulator TRENDY and application to SOI-devices. - Philip B. M. Wolbert; Gerhard K. M. Wachutka; Benno H. Krabbenborg; Ton J. Mouthaan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1994)

Avalanche breakdown capability of Power DMOS Transistors and the Wunsch-Bell relation. - A. Icaza Deckelmann; Gerhard K. M. Wachutka; Franz Hirler; J. Krumrey; R. Henninger (Microelectron. Reliab., 2003)

Reliability of power electronic devices against cosmic radiation-induced failure. - Gerald Sölkner; Winfried Kaindl; Hans-Joachim Schulze; Gerhard K. M. Wachutka (Microelectron. Reliab., 2004)

Physically rigorous modeling of internal laser-probing techniques for microstructured semiconductor devices. - Robert K. Thalhammer; Gerhard K. M. Wachutka (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004)

Corrections to "Physically Rigorous Modeling of Internal Laser-Probing Techniques for Microstructured Semiconductor Devices". - Robert K. Thalhammer; Gerhard K. M. Wachutka (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004)

Thermal characterisation of power devices during transient operation. - Alberto Castellazzi; Martin Honsberg-Riedl; Gerhard K. M. Wachutka (Microelectron. J., 2006)

Virtual Prototyping of Microdevices and Microsystems. - Gerhard K. M. Wachutka (DistIntellSys, 2008)

Testing semiconductor devices at extremely high operating temperatures. - Peter Borthen; Gerhard K. M. Wachutka (Microelectron. Reliab., 2008)

Combination of thermal subsystems by use of rapid circuit transformation and extended two-port theory. - Y. C. Gerstenmaier; W. Kiffe; Gerhard K. M. Wachutka (Microelectron. J., 2009)

The art of modeling and predictive simulation in power electronics and microsystems. - Gerhard K. M. Wachutka (MIXDES, 2013)

Evaluation of thermal transient characterization methodologies for high-power LED applications. - Stefan Müller; Thomas Zahner; Frank Singer; Gabriele Schrag; Gerhard K. M. Wachutka (Microelectron. J., 2013)

Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP). - Dennis Helmut; Gerhard K. M. Wachutka; Gerhard Groos (Microelectron. Reliab., 2017)

High-Throughput Apparatus for Semiconductor Device Characterization in a Magnetic Field at Extreme High Temperatures. - Hesham Okeil; Gabriele Schrag; Gerhard K. M. Wachutka (IEEE Trans. Instrum. Meas., 2023)