The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. - Mohd Khairuddin Md Arshad; Ibrahim Ahmad; Azman Jalar; Ghazali Omar (Microelectron. Reliab., 2006)

Effect of wafer thinning methods towards fracture strength and topography of silicon die. - Hoh Huey Jiun; Ibrahim Ahmad; Azman Jalar; Ghazali Omar (Microelectron. Reliab., 2006)