In-depth circuits edit analysis to reveal the implantation-related defect. - Changqing Chen; Ghim Boon Ang; Jeffrey Lam; Zhihong Mai (Microelectron. J., 2017)

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Soh Ping Neo; Dayanand Nagalingam; Kim Hong Yip; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Hui Peng Ng; Alfred C. T. Quah; Angela Teo; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect. - Soh Ping Neo; Alfred C. T. Quah; Ghim Boon Ang; Dayanand Nagalingam; Hnin Hnin Ma; Siong Luong Ting; C. W. Soo; Changqing Chen; Zhihong Mai; Jeffrey Lam (Microelectron. Reliab., 2017)

Static fault localization of subtle metallization defects using near infrared photon emission microscopy. - Alfred C. T. Quah; Dayanand Nagalingam; Seung Je Moon; Edy Susanto; Ghim Boon Ang; Soh Ping Neo; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2017)