System on Wafer: A New Silicon Concept in SiP. - Gilles Poupon; Nicolas Sillon; David Henry; Charlotte Gillot; Alan Mathewson; Léa Di Cioccio; Barbara Charlet; Patrick Leduc; Maud Vinet; Perrine Batude (Proc. IEEE, 2009)

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)