Program word-line voltage generator for multilevel flash memories. - Osama Khouri; Rino Micheloni; Andrea Sacco; Giovanni Campardo; Guido Torelli (ICECS, 2000)

Hierarchical Sector Biasing Organization for Flash Memories. - Rino Micheloni; Matteo Zammattio; Giovanni Campardo; Osama Khouri; Guido Torelli (MTDT, 2000)

40-mm2 3-V-only 50-MHz 64-Mb 2-b/cell CHE NOR flash memory. - Giovanni Campardo; Rino Micheloni; Stefano Commodaro; Emilio Yero; Matteo Zammattio; Sabina Mognoni; Andrea Sacco; Massimiliano Picca; Alessandro Manstretta; Marco Scotti; Ilaria Motta; C. Golla; et al. (IEEE J. Solid State Circuits, 2000)

Modular architecture for a family of multilevel 256/192/128/64 Mbit 2-bit/cell 3 V-only NOR flash memory devices. - Andrea Silvagni; Stefano Zanardi; Alessandro Manstretta; Marco Scotti; Luca Crippa; Giancarlo Ragone; Giuseppe Fusillo; Giovanni Campardo; Osama Khouri; Marcello Stefanelli (ICECS, 2001)

An overview of flash architectural developments. - Giovanni Campardo; Marco Scotti; Salvatrice Scommegna; Sebastiano Pollara; Andrea Silvagni (Proc. IEEE, 2003)

The flash memory read path: building blocks and critical aspects. - Rino Micheloni; Luca Crippa; Miriam Sangalli; Giovanni Campardo (Proc. IEEE, 2003)

A Reduced Output Ringing CMOS Buffer. - Michele Bartolini; Paolo Pulici; Pier Paolo Stoppino; Giovanni Campardo; Gian Pietro Vanalli (IEEE Trans. Circuits Syst. II Express Briefs, 2007)

Risks for Signal Integrity in System in Package and Possible Remedies. - Daniele Rossi 001; Paolo Angelini; Cecilia Metra; Giovanni Campardo; Gian Pietro Vanalli (ETS, 2008)

A Modified IBIS Model Aimed at Signal Integrity Analysis of Systems in Package. - Paolo Pulici; Antonio Girardi; Gian Pietro Vanalli; Roberto Izzi; Giacomo Bernardi; Giancarlo Ripamonti; Antonio G. M. Strollo; Giovanni Campardo (IEEE Trans. Circuits Syst. I Regul. Pap., 2008)

SoC and SiP, the Yin and Yang of the Tao for the New Electronic Era. - Alfonso Maurelli; Didier Belot; Giovanni Campardo (Proc. IEEE, 2009)

Signal Integrity Flow for System-in-Package and Package-on-Package Devices. - Paolo Pulici; Gian Pietro Vanalli; Michele A. Dellutri; Domenico Guarnaccia; Filippo Lo Iacono; Giovanni Campardo; Giancarlo Ripamonti (Proc. IEEE, 2009)