Curing Process on Passivation Layer for Backside-Illuminated CMOS Image Sensor Application. - Jongseo Park; Kyeong-Keun Choi; Jehyun An; Bohyeon Kang; Hyeonseo You; Giryun Hong; Sung-Min Ahn; Rock-Hyun Baek (IEEE Access, 2023)

FEOL Monolithic Co-Integration of FeFET and CMOS on 8-Inch Wafer Using Laser Spike Annealing With Implementation of an FeFET Inverter. - Bohyeon Kang; Jehyun An; Jongseo Park; Giryun Hong; Beomjoo Ham; Jaeseong Pyo; Sung-Min Ahn; Rock-Hyun Baek (IEEE Access, 2024)