Study of EM void nucleation and mechanic relaxation effects. - Giulio Marti; Lucile Arnaud; Yves Wouters (Microelectron. Reliab., 2014)

Interconnect design study for electromigration reliability improvement. - Giulio Marti; Lucile Arnaud; David Ney; Yves Wouters (IRPS, 2015)

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. - Gayle Murdoch; Matin O'Toole; Giulio Marti; Ankit Pokhrel; Diana Tsvetanova; Stefan Decoster; Shreya Kundu; Yusuke Oniki; Arame Thiam; Quoc Toan Le; Olalla Varela Pedreira; Alicja Lesniewska; et al. (VLSI Technology and Circuits, 2022)

Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects. - Anshul Gupta; Shreya Kundu; Stefan Decoster; K. Sah; G. Delie; B. Truijen; Davide Tierno; Giulio Marti; O. Varela Pedreira; B. Kenens; Y. Hermans; C. Adelmann; et al. (VLSI Technology and Circuits, 2024)