Test structure assembly for bump bond yield measurement on high density flip chip technologies. - Miguel Ullán; Manuel Lozano 003; Mokhtar Chmeissani; G. Blanchot; Enric Cabruja; J. García; M. Maiorino; Ricardo Martínez; Giulio Pellegrini; Carles Puigdengoles (Microelectron. Reliab., 2006)

Study of Ionization Charge Density-Induced Gain Suppression in LGADs. - María del Carmen Jiménez-Ramos; Javier García López; Adrián García-Osuna; Iván Vila; Esteban Currás; Richard Jaramillo; Salvador Hidalgo; Giulio Pellegrini (Sensors, 2022)

Inverse LGAD (iLGAD) Periphery Optimization for Surface Damage Irradiation. - Albert Doblas; David Flores; Salvador Hidalgo; Neil Moffat; Giulio Pellegrini; David Quirion; Jairo Villegas; Dzmitry Maneuski; Marie Ruat; Pablo Fajardo (Sensors, 2023)