Linking TCAD to EDA - Benefits and Issues. - Goodwin R. Chin; Walter C. Dietrich Jr.; Duane S. Boning; Alexander S. Wong; Andrew R. Neureuther; Robert W. Dutton (DAC, 1991)

A STRIDE towards practical 3-D device simulation-numerical and visualization considerations. - Ke-Chih Wu; Goodwin R. Chin; Robert W. Dutton (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1991)

A utility-based integrated system for process simulation. - Edward W. Scheckler; Alexander S. Wong; Robert K. Wang; Goodwin R. Chin; John R. Camagna; Andrew R. Neureuther; Robert W. Dutton (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1992)

A tool towards integration of IC process, device, and circuit simulation. - Goodwin R. Chin; Robert W. Dutton (IEEE J. Solid State Circuits, 1992)

C++ Design and Implementation Challenges in Technology Computer Aided Design Frameworks. - Goodwin R. Chin; Dharini Sitaraman; Cung Yang; Martin D. Giles (C++ Conference, 1994)

Semiconductor wafer representation for TCAD. - Martin D. Giles; Duane S. Boning; Goodwin R. Chin; Walter C. Dietrich Jr.; Michael S. Karasick; Mark E. Law; Purnendu K. Mozumder; Lee R. Nackman; V. T. Rajan; Duncan M. Hank Walker; Robert H. Wang; Alexander S. Wong (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1994)