Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles. - Sebastian Micus; Ivan Kirsten; Michael Haupt; Götz T. Gresser (Sensors, 2020)

Integrative design and fabrication methodology for bio-inspired folding mechanisms for architectural applications. - Axel Körner; Larissa Born; Oliver Bucklin; Seiichi Suzuki; Lauren Vasey; Götz T. Gresser; Achim Menges; Jan Knippers (Comput. Aided Des., 2021)

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering. - Sebastian Micus; Michael Haupt; Götz T. Gresser (Sensors, 2021)

Computational co-design framework for coreless wound fibre-polymer composite structures. - Marta Gil Pérez; Christoph Zechmeister; Fabian Kannenberg; Pascal Mindermann; Laura Balangé; Yanan Guo; Sebastian Hügle; Andreas Gienger; David Forster; Manfred Bischoff; Cristina Tarín; Peter Middendorf; et al. (J. Comput. Des. Eng., 2022)

Object model data sets of the case study specimens for the computational co-design framework for coreless wound fibre-polymer composite structures. - Marta Gil Pérez; Christoph Zechmeister; Fabian Kannenberg; Pascal Mindermann; Laura Balangé; Yanan Guo; Sebastian Hügle; Andreas Gienger; David Forster; Manfred Bischoff; Cristina Tarín; Peter Middendorf; et al. (DaRUS, 2023)

Data processing, analysis, and evaluation methods for co-design of coreless filament-wound building systems. - Marta Gil Pérez; Pascal Mindermann; Christoph Zechmeister; David Forster; Yanan Guo; Sebastian Hügle; Fabian Kannenberg; Laura Balangé; Volker Schwieger; Peter Middendorf; Manfred Bischoff; Achim Menges; et al. (J. Comput. Des. Eng., 2023)

Toward reciprocal feedback between computational design, engineering, and fabrication to co-design coreless filament-wound structures. - Fabian Kannenberg; Christoph Zechmeister; Marta Gil Pérez; Yanan Guo; Xiliu Yang; David Forster; Sebastian Hügle; Pascal Mindermann; Moataz Abdelaal; Laura Balangé; Volker Schwieger; Daniel Weiskopf; et al. (J. Comput. Des. Eng., 2024)