TSV metrology and inspection challenges. - Ramakanth Alapati; Youssef Travaly; Jan Van Olmen; Ricardo Cotrin Teixeira; Jan Vaes; Marc van Cauwenbergh; Anne Jourdain; Greet Verbinnen; Gino Marcuccilli; Glenn Florence; Shay Wolfling; Christine Pelissier; et al. (3DIC, 2009)

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)

Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design. - Alexandru Andrei; Nina Tutunjyan; Greet Verbinnen; Steven VanPut; Olga Krylychkina; Wolfgang Eberle; Silke Musa (EMBC, 2012)