Photoresists for 193-nm lithography. - Robert D. Allen; Gregory M. Wallraff; Donald C. Hofer; Roderick R. Kunz (IBM J. Res. Dev., 1997)

Chemical and physical aspects of the post-exposure baking process used for positive-tone chemically amplified resists. - William D. Hinsberg; Frances A. Houle; Martha I. Sanchez; Gregory M. Wallraff (IBM J. Res. Dev., 2001)