The HDL and FE Thermal Modeling of Heterogeneous Systems. - Grzegorz Janczyk; Tomasz Bieniek (DDECS, 2008)

Reliability issues of e-Cubes heterogeneous system integration. - Grzegorz Janczyk; Tomasz Bieniek; Jerzy Szynka; Piotr Grabiec (Microelectron. Reliab., 2008)

Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors. - Grzegorz Janczyk; Tomasz Bieniek; Jerzy Szynka; Piotr Grabiec (3DIC, 2009)

Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation. - Tomasz Bieniek; Grzegorz Janczyk; Rafal Dobrowolski; Dariusz Szmigiel; Magdalena Ekwinska; Piotr Grabiec; Pawel Janus; Jerzy Zajac (3DIC, 2013)

Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example. - Tomasz Bieniek; Grzegorz Janczyk; Magdalena Ekwinska; T. Budzynski; Piotr Gluszko; Piotr Grabiec; Andrzej Kociubinski (3DIC, 2014)

Innovative SiC over Si photodiode based dual-band, 3D integrated detector. - Andrzej Kociubinski; M. Duk; Tomasz Bieniek; Grzegorz Janczyk; Michal Borecki (3DIC, 2014)

Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method. - Grzegorz Janczyk; Tomasz Bieniek; Jerzy Wasowski; Piotr Grabiec (Microelectron. J., 2014)