High-performance processor design based on 3D on-chip cache. - Lei Yi; Guangbao Shan; Song Liu; Chengmin Xie (Microprocess. Microsystems, 2016)

A Fast Analysis Method of Multiphysics Coupling for 3-D Microsystem. - Xiaopeng Wu; Mingpeng Cao; Guangbao Shan; Yintang Yang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

A wafer-level 3D integrated T/R microsystem with 0.5-wavelength self-matching connectors. - Shengchang Zhang; Guangbao Shan; Yi Luo; Hui Deng (Microelectron. J., 2024)

A DC-5 GHz TSV-Based 3-D Network for Multichiplet Wireless System Reconfiguration. - Yanwen Zheng; Guangbao Shan; Lihong Yang; Xiang Fan; Huihua Cao (IEEE Internet Things J., 2025)

An intelligent thermo-mechanical coupling collaborative design technique for 2.5D chiplet heterogeneous integration (CHI) system. - Yu Fu; Guoliang Li; Guangbao Shan; Zeyu Chen; Hongrui Zhao; Yintang Yang (Microelectron. J., 2025)