Effects of device passivation materials on solderable metallization of IGBTs. - Shatil Haque; Guo-Quan Lu (Microelectron. Reliab., 2001)

Design issues of a three-dimensional packaging scheme for power modules. - Shatil Haque; Kalyan Siddabattula; Mike Craven; Sihua Wen; Xingsheng Liu; Dushan Boroyevich; Guo-Quan Lu (Microelectron. Reliab., 2001)

Stacked solder bumping technology for improved solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2001)

Effect of substrate flexibility on solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2002)

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. - Y. C. Lin; Xu Chen 039; Xingsheng Liu; Guo-Quan Lu (Microelectron. Reliab., 2005)

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. - Gang Chen 028; Ze-Sheng Zhang; Yun-Hui Mei; Xin Li 039; Guo-Quan Lu; Xu Chen 039 (Microelectron. Reliab., 2013)

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. - Xin Li 039; Gang Chen 028; Xu Chen 039; Guo-Quan Lu; Lei Wang 064; Yun-Hui Mei (Microelectron. Reliab., 2013)

Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions. - Haidong Yan; Yun-Hui Mei; Xin Li 039; Pu Zhang; Guo-Quan Lu (Microelectron. Reliab., 2015)

Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate. - Su-Yan Zhao; Xin Li 039; Yun-Hui Mei; Guo-Quan Lu (Microelectron. Reliab., 2015)

Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules. - Hanguang Zheng; Khai D. T. Ngo; Guo-Quan Lu (Microelectron. Reliab., 2015)

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. - David Berry; Adrian Townsend; Weikun He; Hanguang Zheng; Khai D. T. Ngo; Guo-Quan Lu (Microelectron. Reliab., 2016)

Over-Molded Inductor (OMI) - Feasibility Demonstration in a DC-DC Converter. - Ting Ge; Yi Yan; Guo-Quan Lu; Khai D. T. Ngo (IEEE Trans. Ind. Electron., 2017)

Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement. - Shan Gao; Khai D. T. Ngo; Guo-Quan Lu (IEEE Trans. Ind. Electron., 2021)

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors. - Shengchang Lu; Tianyu Zhao; Zichen Zhang 015; Khai D. T. Ngo; Rolando Burgos; Guo-Quan Lu (IEEE Trans. Ind. Electron., 2023)

Double-Sided Cooling Half-Bridge Power Module of 650V/150A Gallium Nitride High-Electron-Mobility Transistor. - Shengchang Lu; Bo Li 137; Emmanuel Arriola; Zichen Zhang 015; Carl Nicholas; Khai D. T. Ngo; Guo-Quan Lu (IEEE Trans. Ind. Electron., 2024)