3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). - Jan Van Olmen; Jan Coenen; Wim Dehaene; Kristin De Meyer; Cedric Huyghebaert; Anne Jourdain; Guruprasad Katti; Abdelkarim Mercha; Michal Rakowski; Michele Stucchi; Youssef Travaly; Eric Beyne; et al. (3DIC, 2009)

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot. - Paul Marchal; Bruno Bougard; Guruprasad Katti; Michele Stucchi; Wim Dehaene; Antonis Papanikolaou; Diederik Verkest; Bart Swinnen; Eric Beyne (Proc. IEEE, 2009)

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. - Geert Van der Plas; Steven Thijs; Dimitri Linten; Guruprasad Katti; Paresh Limaye; Abdelkarim Mercha; Michele Stucchi; Herman Oprins; Bart Vandevelde; Nikolaos Minas; Miro Cupac; Morin Dehan; et al. (CICC, 2010)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique. - Michele Stucchi; Dimitrios Velenis; Guruprasad Katti (IEEE Trans. Instrum. Meas., 2012)

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). - Guruprasad Katti; S. W. Ho; Li Hong Yu; Songbai Zhang; Rahul Dutta; Roshan Weerasekera; Ka-Fai Chang; Jong-Kai Lin; Srinivasa Rao Vempati; Surya Bhattacharya (IEEE Des. Test, 2015)