Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. - Andrej Ivankovic; Kris Vanstreels; Daniel Vanderstraeten; Guy Brizar; Renaud Gillon; Eddy Blansaer; Bart Vandevelde (Microelectron. Reliab., 2012)

Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage. - John M. McGlone; Guy Brizar; Daniel Vanderstraeten; Dorai Iyer; Sallie Hose; Jeff P. Gambino (IRPS, 2020)