Structural models of antibody variable fragments: A method for investigating binding mechanisms. - Samuel Petit; Frédéric Brard; Gérard Coquerel; Guy Perez; François Tron (J. Comput. Aided Mol. Des., 1998)

Impact of Technology Spreading on MEMS design Robustness. - Vincent Beroulle; Laurent Latorre; M. Dardalhon; Coumar Oudéa; Guy Perez; Francis Pressecq; Pascal Nouet (VLSI-SOC, 2001)

Reliability analysis of CMOS MEMS structures obtained by Front Side Bulk Micromachining. - M. Dardalhon; Vincent Beroulle; Laurent Latorre; Pascal Nouet; Guy Perez; Jean Marc Nicot; Coumar Oudéa (Microelectron. Reliab., 2002)

Solar Cell Analysis with Light Emission and OBIC Techniques. - Kevin Sanchez; Romain Desplats; Guy Perez; V. Pichetto; Felix Beaudoin; Philippe Perdu (Microelectron. Reliab., 2003)

Long-term reliability of silicon bipolar transistors subjected to low constraints. - A. Crosson; Laurent Escotte; Marise Bafleur; D. Talbourdet; L. Crétinon; Philippe Perdu; Guy Perez (Microelectron. Reliab., 2007)

Upscreening of LED COTS for space science applications. - Kateryna Kiryukhina; Guy Perez; Elsa Locatelli; Hélène Chauvin; Elisa Peis (Microelectron. Reliab., 2015)

A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. - Jean-Baptiste Sauveplane; Patrice Retho; Norbert Venet; David Buso; Guy Perez; Jean-Sébastien Lefrileux (Microelectron. Reliab., 2015)