Reliable power electronics for automotive applications. - Norbert Seliger; E. Wolfgang; Guy Lefranc; H. Berg; T. Licht (Microelectron. Reliab., 2002)

High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. - Gerard Coquery; Guy Lefranc; T. Licht; Richard Lallemand; Norbert Seliger; H. Berg (Microelectron. Reliab., 2003)

Aluminum bond-wire properties after 1 billion mechanical cycles. - Guy Lefranc; Brigitte Weiss; Christof Klos; J. Dick; Golta Khatibi; H. Berg (Microelectron. Reliab., 2003)