Correlation between chemistry of polymer building blocks and microelectronics reliability. - H. J. L. Bressers; W. D. van Driel; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang (Microelectron. Reliab., 2007)

Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Novel shear tools for viscoelastic characterization of packaging polymers. - C. van't Hof; Kaspar M. B. Jansen; G. Wisse; Leo J. Ernst; Dao-Guo Yang; G. Q. Zhang; H. J. L. Bressers (Microelectron. Reliab., 2007)

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Numerical modeling of warpage induced in QFN array molding process. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; W. D. van Driel; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)