Study of dielectric material property impact on insertion loss for advanced packaging solutions. - Bok Eng Cheah; H. Louis Lo; Jackson Kong (ICCE-TW, 2015)

New Electrical Modeling Method for Signal Integrity of Ultra-Small Electronic Device. - H. Louis Lo (ICCE, 2019)

The Hybrid Coplanar Transmission Line Design and Simulation for an Ultra Small Solid State Drive with Massive Storage Capacity Used in Mobile Device. - H. Louis Lo; Hany Eskandar (ICCE, 2019)