Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. - C. W. Tan; Y. C. Chan; H. P. Chan; N. W. Leung; C. K. So (Microelectron. Reliab., 2004)

Adhesion strength and contact resistance of flip chip on flex packages–effect of curing degree of anisotropic conductive film. - M. A. Uddin; M. O. Alam; Yan Cheong Chan; H. P. Chan (Microelectron. Reliab., 2004)

Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride. - C. K. Wong; Hei Wong; Mansun Chan; Chi-Wah Kok; H. P. Chan (Microelectron. Reliab., 2006)

Silicon oxynitride integrated waveguide for on-chip optical interconnects applications. - C. K. Wong; Hei Wong; Mansun Chan; Y. T. Chow; H. P. Chan (Microelectron. Reliab., 2008)

Sensing Characteristics of Fiber Fabry-Perot Sensors Based on Polymer Materials. - Zheng-Da Liu; Bin Liu 048; Juan Liu 010; Yanjun Fu; Mengyu Wang; Sheng-Peng Wan; Xingdao He; Jinhui Yuan; Hau-Ping Chan; Qiang Wu 005 (IEEE Access, 2020)

Cascaded Optical Fiber Sensor for Simultaneous Measurement of Ultraviolet Irradiance and Temperature. - Ru-Lei Xia; Juan Liu 010; Bin Liu 048; Xingdao He; Hau-Ping Chan; Jinhui Yuan; Xicong Li; Zabih Ghassemlooy; Qiao Gao; Yingying Hu; Qiang Wu 005 (CSNDSP, 2024)