Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. - H. V. Nguyen; Cora Salm; J. Vroemen; J. Voets; Benno Krabbenborg; Jaap Bisschop; A. J. Mouthaan; Fred G. Kuper (Microelectron. Reliab., 2002)

Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. - H. V. Nguyen; Cora Salm; R. Wenzel; A. J. Mouthaan; Fred G. Kuper (Microelectron. Reliab., 2002)