Stress-Engineered SLIM-Cut of Ultra-Thin Silicon Using Saccharin-Modified Electroplated Ni Films. - Myoungsu Chae; Sang Hee Lee; Eunbin Jo; Ha-Seop Jeong; Seeun Kim; Minsu Jang; Sungjun Hwang; Dong Jun Ji; Hee Joon Lee; Sun Ah Park; Jeong Kim; Doowon Lee (IEEE Access, 2026)