Simulative prediction of the resistance change due to electromigration induced void evolution. - Hajdin Ceric; Siegfried Selberherr (Microelectron. Reliab., 2002)

Physically based models of electromigration: From Black's equation to modern TCAD models. - R. L. de Orio; Hajdin Ceric; Siegfried Selberherr (Microelectron. Reliab., 2010)

Interface traps density-of-states as a vital component for hot-carrier degradation modeling. - Stanislav Tyaginov; Ivan A. Starkov; Oliver Triebl; Johann Cervenka; Christoph Jungemann; Sara Carniello; Jong Mun Park; Hubert Enichlmair; Markus Karner; Ch. Kernstock; Ehrenfried Seebacher; Rainer Minixhofer; et al. (Microelectron. Reliab., 2010)

A simulator for local anodic oxidation of silicon surfaces. - Lado Filipovic; Hajdin Ceric; Johann Cervenka; Siegfried Selberherr (CCECE, 2011)

A compact model for early electromigration failures of copper dual-damascene interconnects. - R. L. de Orio; Hajdin Ceric; Siegfried Selberherr (Microelectron. Reliab., 2011)

An analytical approach for physical modeling of hot-carrier induced degradation. - Stanislav Tyaginov; Ivan A. Starkov; Hubert Enichlmair; Christoph Jungemann; Jong Mun Park; Ehrenfried Seebacher; R. L. de Orio; Hajdin Ceric; Tibor Grasser (Microelectron. Reliab., 2011)

Interconnect reliability dependence on fast diffusivity paths. - Hajdin Ceric; Roberto Lacerda de Orio; Siegfried Selberherr (Microelectron. Reliab., 2012)

Electromigration failure in a copper dual-damascene structure with a through silicon via. - Roberto Lacerda de Orio; Hajdin Ceric; Siegfried Selberherr (Microelectron. Reliab., 2012)

Stress evolution in the metal layers of TSVs with Bosch scallops. - Anderson Pires Singulani; Hajdin Ceric; Siegfried Selberherr (Microelectron. Reliab., 2013)

Electromigration reliability of open TSV structures. - Wolfhard H. Zisser; Hajdin Ceric; Josef Weinbub; Siegfried Selberherr (Microelectron. Reliab., 2014)

Comparison of analytic distribution function models for hot-carrier degradation modeling in nLDMOSFETs. - Prateek Sharma; Stanislav Tyaginov; Yannick Wimmer; Florian Rudolf; Karl Rupp; Hubert Enichlmair; J. H. Park; Hajdin Ceric; Tibor Grasser (Microelectron. Reliab., 2015)

Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics. - Hajdin Ceric; Roberto Lacerda de Orio; Siegfried Selberherr (ESSDERC, 2022)

Impact of via geometry and line extension on via-electromigration in nano-interconnects. - Ahmed Sobhi Saleh; Houman Zahedmanesh; Hajdin Ceric; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Electromigration in Gold: Challenges and Possibilities (Invited). - Hajdin Ceric (IRPS, 2025)

Novel Concept-Oriented Synthetic Data approach for Training Generative AI-Driven Crystal Grain Analysis Using Diffusion Model. - Ahmed Sobhi Saleh; Kristof Croes; Hajdin Ceric; Ingrid De Wolf; Houman Zahedmanesh (CoRR, 2025)