Interfacial thermal stresses in solder joints of leadless chip resistors. - Hamid R. Ghorbani; Jan K. Spelt (Microelectron. Reliab., 2006)

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. - Yan Qi; Rex Lam; Hamid R. Ghorbani; Polina Snugovsky; Jan K. Spelt (Microelectron. Reliab., 2006)

Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. - Dwayne R. Shirley; Hamid R. Ghorbani; Jan K. Spelt (Microelectron. Reliab., 2008)