Reliability Challenges with Self-Heating and Aging in FinFET Technology. - Hussam Amrouch; Victor M. van Santen; Om Prakash 007; Hammam Kattan; Sami Salamin; Simon Thomann; Jörg Henkel (IOLTS, 2019)

NPU Thermal Management. - Hussam Amrouch; Georgios Zervakis 001; Sami Salamin; Hammam Kattan; Iraklis Anagnostopoulos; Jörg Henkel (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)

Longevity of Commodity DRAMs in Harsh Environments Through Thermoelectric Cooling. - Deepak M. Mathew; Hammam Kattan; Christian Weis; Jörg Henkel; Norbert Wehn; Hussam Amrouch (IEEE Access, 2021)

On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array. - Hammam Kattan; Sung Woo Chung; Jörg Henkel; Hussam Amrouch (IEEE Micro, 2021)

Advanced Thermal Management using Approximate Computing and On-Chip Thermoelectric Cooling. - Hammam Kattan; Hussam Amrouch (SBCCI, 2022)

Impact of NCFET Technology on Eliminating the Cooling Cost and Boosting the Efficiency of Google TPU. - Sami Salamin; Georgios Zervakis 001; Florian Klemme; Hammam Kattan; Yogesh Singh Chauhan; Jörg Henkel; Hussam Amrouch (IEEE Trans. Computers, 2022)

Temperature-Aware Memory Mapping and Active Cooling of Neural Processing Units. - Vahidreza Moghaddas; Hammam Kattan; Tim Bücher; Mikail Yayla; Jian-Jia Chen; Hussam Amrouch (ISLPED, 2023)