Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism. - Jongwoo Park 001; Miji Lee; Hanbyul Kang; Wooram Ko; Eunkyeong Choi; Junsik Im; Minwoo Lee; Dohwan Chung; Jinchul Park; Sangchul Shin; Sangwoo Pae (IRPS, 2015)

Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation. - Jongwoo Park 001; Miji Lee; Kyunghwan Min; J.-K. Choi; Changkyu Joo; S.-C. Park; Hanbyul Kang; Sangwoo Pae (IRPS, 2015)

Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR). - Seongwon Jeong; Jinseok Kim 005; Ayoung Kim; Byungwook Kim; Moonsoo Lee; Jaewon Chang; In Hak Baick; Hanbyul Kang; Younggeun Ji; Sangchul Shin; Sangwoo Pae (IRPS, 2018)