Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules. - Hanguang Zheng; Khai D. T. Ngo; Guo-Quan Lu (Microelectron. Reliab., 2015)

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. - David Berry; Adrian Townsend; Weikun He; Hanguang Zheng; Khai D. T. Ngo; Guo-Quan Lu (Microelectron. Reliab., 2016)