Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution. - Torsten Linz; Malte von Krshiwoblozki; Hans Walter (BSN, 2010)

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. - Bernhard Wunderle; E. Dermitzaki; O. Hölck; Jörg Bauer 002; Hans Walter; Q. Shaik; K. Rätzke; Franz Faupel; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2010)

Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling. - O. Hölck; Jörg Bauer 002; Tanja Braun; Hans Walter; Olaf Wittler; Bernhard Wunderle; Klaus-Dieter Lang (Microelectron. Reliab., 2013)

Improving the FE simulation of molded packages using warpage measurements. - Saskia Huber; Marius van Dijk; Hans Walter; Olaf Wittler; Tina Thomas; Klaus-Dieter Lang (Microelectron. Reliab., 2014)